| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition which, at the time of using for a thin film adhesion, is excellent in heat resistance, crack resistance, adhesive properties, and such oozing resistance as to cause little exudate. SOLUTION: The adhesive composition comprising (A) an epoxy resin, (B) an epoxy group-containing polymer compound having a weight-average molecular weight of 100,000 or more and (C) an epoxy curing agent, is characterized in that the component (A), the component (B) and the component (C) are codissolved before curing, and an adhesive film comprising the adhesive composition and having a film thickness of 50μm or more is cured to cause a phase separation and to thereby form a phase separation structure having a structural cycle of 0.5μm or more, and also the adhesive film comprising the adhesive composition and having a film thickness of 0.01-20μm is cured to cause a phase separation and to thereby form a phase separation structure having a structural cycle of not less than 0.01μm to less than 0.5μm. COPYRIGHT: (C)2008,JPO&INPIT
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