发明名称 |
Stamped leadframe and method of manufacture thereof |
摘要 |
A stamped leadframe for a leadless package and a method of manufacturing the same are provided wherein the leadframe has at least a die pad, a frame, tie bars connecting the die pad to the frame and a plurality of leads. Each lead comprises a first portion and a second portion, and the second portion is connected substantially parallel to and displaced relative to the first portion by a distance that is less than the thickness of the first portion. Portions of the tie-bars and/or die pad may be similarly displaced.
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申请公布号 |
US2008122048(A1) |
申请公布日期 |
2008.05.29 |
申请号 |
US20060509860 |
申请日期 |
2006.08.25 |
申请人 |
ASM ASSEMBLY MATERIALS LTD. |
发明人 |
CHAN TAT CHI;CHENG MAN SHING |
分类号 |
H01L23/495;H01R43/00;H05K7/18 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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