| 摘要 |
An L.E.D. lamp assembly ( 20 ) includes an electrically insulative coating ( 24 ) disposed on a thermally conductive substrate ( 22 ). A plurality of light emitting diodes ( 26 ) are secured to the coating ( 24 ) and a circuit ( 40 ) is adhesively secured to the coating ( 24 ) in predetermined spaced lengths ( 42 ) along the coating ( 24 ) to establish discrete and electrically conductive spaced lengths ( 42 ) with the light emitting diodes ( 26 ) disposed between the spaced lengths ( 42 ). LED electrical leads ( 32 ) are secured to the spaced lengths ( 42 ) of the circuit ( 40 ) to electrically interconnect the light emitting diodes ( 26 ). The circuit ( 40 ) includes a foil tape ( 46 ) having an electrically conductive tape portion ( 48 ) and a coupling portion ( 50 ) disposed on the tape portion ( 48 ) for securing the foil tape ( 46 ) to the insulated substrate ( 22 ). Heat generated by the light emitting diodes ( 26 ) is transferred through the insulative coating ( 24 ) to the electrically and thermally conductive substrate ( 22 ) for dissipating the heat.
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