| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition provided with excellent photosensitive characteristic and a semiconductor device. <P>SOLUTION: The photosensitive resin composition comprises a resin component (A) of which the alkali solubility changes under the action of acid, a photoreactive compound (B) which generates the above acid by a photoreaction, and a solvent (C), wherein a heat resistant resin compound comprising a polyimide precursor or polybenzoxazole precursor having an asymmetric carbon site represented by a general formula (1) is used as the resin component (A), wherein X<SB>1</SB>is a divalent to tetravalent organic group; Y<SB>1</SB>is a divalent to hexavalent organic group; p and q are each 0 or an integer of 1-4; R<SB>1</SB>is a hydrogen atom or a 1-20C organic group; l and m are each 0 or an integer of 1-2; and n is an integer of 2-1,000, provided that R<SB>1</SB>is hydrogen or a monovalent organic group. <P>COPYRIGHT: (C)2008,JPO&INPIT |
