| 摘要 |
PROBLEM TO BE SOLVED: To make a semiconductor device such as a solid-state image sensor or the like compact and thin as well as ensure its moisture resistance. SOLUTION: The semiconductor device is provided with a resin package 2 (supporting body) having a lead 1, an image sensing element 3 (semiconductor element) connected electrically to the lead 1, an optical transmission cover plate 7 (cover body) that is fitted to the image sensing element 3 as to cover the specified area of one main surface of the image sensing element 3, a resin sealing part 15 that seals the lead 1 and the joint part between a metal wire 6 connected thereto and the image sensing element 3, and a resin covering part 16 that is provided on the resin sealing part 15 as to cover the outer periphery of the optical transmission cover plate 7. The resin covering part 16 is formed of a moisture-resistant resin material or a moisture absorbing material-containing resin material. In this case, the optical transmission cover plate 7 is directly attached to the image sensing element 3, so as to make the device thin. If the moisture absorbing material-containing sealing resin is employed, water content is absorbed into the moisture absorbing material. If the moisture-resistant sealing resin is employed, it is essentially hard to absorb moisture, thus preventing water content from permeating into the boundary between the resin sealing part 15 and the optical transmission cover plate 7. COPYRIGHT: (C)2008,JPO&INPIT |
