| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating device and a plating method capable of enhancing the uniformity of a plated film thickness and the uniformity of a plated film surface by controlling the current density distribution in a plating tank uniformly and regulating the flow of a plating solution. SOLUTION: The plating device is equipped with: a resistor holder 60 for holding a resistor R installed so as to shield the plating solution Q held in a plating unit 30 to the anode 10 side and the substrate W side; a shield 170 for shielding an electrical path not passing through the resistor R; plating solution jetting ports 183A, B for jetting the plating solution to a gap S1 between the substrate W and the resistor R to flow the solution through the gap S1; and plating solution circulation systems 250, 260 for circulating the plating solution through the anode area A2 partitioned by the resistor R and the resistor holder 60 and a substrate area A1, respectively. A partition member is provided in an overflow tank 40 to shield between the plating solutions overflowing from each of the substrate area A1 and the anode area A2. COPYRIGHT: (C)2008,JPO&INPIT
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