摘要 |
<p>The unit has a sensor body (10) comprising conducting paths (21, 29, 30) arranged between substrates (11, 12). Through holes (22, 31, 32) are inserted into the substrates, and are lined with electrically conducting material, where the through holes establish a through-connection between the conducting paths. The through holes are arranged in the substrates in such a manner that each of the through holes in the substrate (11) is displaced opposite to each of the through holes in the substrate (12).</p> |