| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing a voltage drop caused by the electric connection of a semiconductor chip and switching noise inexpensively. <P>SOLUTION: The semiconductor device 100 has: a substrate 10 having external electrodes 11, 12, 13 for transmitting signals or supplying power to the outside; a semiconductor chip 30 that is arranged in a region in which no external electrodes exist on the substrate 10 and has a power supply pad 31 wire-connected to the external electrode 11 on a main surface; and an interposer 40 that is arranged on the main surface on which no power supply pads 31 exist on the semiconductor chip 30, is connected to the semiconductor chip 30 via connection pins 50, 51, and has conductor layers 41, 42 wire-connected to the external electrodes 12, 13 for supplying power. <P>COPYRIGHT: (C)2008,JPO&INPIT |
