| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable light emitting diode device that can reduce a manufacturing cost. <P>SOLUTION: The light emitting diode device includes a wiring board having a first surface and a second surface as the rear side of the first surface wherein the first surface is provided with a first electrode charged to have a first polarity, a second electrode charged to have a second polarity, and a frame that is formed in the lower part thereof simultaneously with formation of the first and second electrodes surrounding the same first and second electrodes, while the second surface is provided with a first external electrode terminal electrically connected to the first electrode and a second external electrode terminal electrically connected to the second electrode, a light emitting diode chip including a first surface and a second surface as the rear side of the first surface wherein the second surface is the light emitting surface and the first surface is provided with first and second connection electrodes that are connected in duplication to the first and second electrodes of the wiring board, and a sealing material formed of an insulating resin formed on the first surface of the wiring board provided at the internal side of the frame and is provided to a part extended to the frame at least from the circumferential surface of the semiconductor chip. <P>COPYRIGHT: (C)2008,JPO&INPIT |
