| 摘要 |
PROBLEM TO BE SOLVED: To provide a core board manufacturing method and a wiring board manufacturing method which suppress the unevenness of the thickness of a conductive layer on the surface of a core board and reduce the conductive layer into a thin film to enable the formation of microwiring. SOLUTION: First conductive layers 59 and 61 are formed on the surface of a copper-coating board 57, and a through-hole conductive layer 23 is formed on the inner peripheral surface of a through-hole 21. A through-hole 25 inside the through-hole conductive layer 23 is filled with a resin hole-filling material 27. A projecting portion of the resin hole-filling material 27 and the surface side of the first conductive layers 59 and 61 are eliminated by first polishing. The surface side of first laminated conductive layers 63 and 65 is also eliminated by etching. The end of the resin hole-filling material 27 that projects as a result of etching is then eliminated by second polishing (buff polishing). Subsequently, the surface of the first laminated conductive layers 63 and 65 and that of the resin hole-filling material 27 are covered with second conductive layers 75 and 77. COPYRIGHT: (C)2008,JPO&INPIT |
