PREPREG, PREPREG PRODUCTION METHOD, PRINTED CIRCUIT BOARD USING THE PREPREG, AND METHOD FOR PRODUCTION OF PRINTED BOARD

摘要

PROBLEM TO BE SOLVED: To solve the problem that it is difficult to use a prepreg using a conventional crystalline resin for making e.g., a circuit board required to have specified strength because of hardness and brittleness inherent in the crystalline resin used to enhance the thermal conductivity of a circuit board. SOLUTION: A crystalline epoxy resin 20 is mixed with a phenyl group 31 (or mesogen)-containing thermoplastic resin such as an amorphous, high-Tg (Tg is a glass transition temperature), and high-strength PPE resin 21, whereupon the phenyl groups 31 of the respective resins are oriented to effect crystallization. After the addition of an inorganic filler 23 to the mixture, the resultant mixture is used to form a prepreg 26. Such prepregs can give a printed wiring board having an improved proof stress (or cracking resistance) and an improved Tg as well as high thermal conductivity. COPYRIGHT: (C)2008,JPO&INPIT