| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element with an adhesive agent layer which can be mounted on a supporting body at low temperature and is nonsticky at room temperature. SOLUTION: The method for manufacturing the semiconductor element comprises at least the steps of polishing the rear surface of a semiconductor wafer, applying an adhesive agent comprising a liquid resin composition to the semiconductor wafer, and dicing the semiconductor wafer for cutting out the semiconductor element. The liquid resin composition used for applying the adhesive agent comprising the liquid resin composition to the semiconductor wafer is the liquid resin composition including a compound (A) having a glycidyl, a compound (B) having a phenolic hydroxyl, a compound (C) for accelerating a reaction between the compound (A) and the compound (B), and a solvent (D). The semiconductor element with the adhesive agent layer has the liquid resin composition with the compound (C) solved in the solvent (D). COPYRIGHT: (C)2008,JPO&INPIT |
