Printed circuit board and method for manufacturing thereof

摘要

A printed circuit board and a method of manufacturing thereof are disclosed. With a printed circuit board comprising an insulating layer; a circuit pattern formed on one side of the insulating layer; an inter-layer conductive part joining with the insulating layer by passing through the insulating layer, and electrically connected to the circuit pattern; a heat dissipating layer laminated on the other side of the insulating layer; and a heat dissipating coating layer interposed between the insulating layer and the heat dissipating layer, and connected with the inter-layer conductive part, the heat contained in the insulating layer may be delivered to the heat dissipating layer effectively and the efficiency of heat dissipation may be improved.