| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device for producing inexpensively a highly reliable semiconductor device. <P>SOLUTION: The method for manufacturing a semiconductor device is characterized in including the steps of forming a bump with a bonding wire on an electrode pad formed in a region corresponding to a semiconductor chip of a substrate, burying a via-hole with conductive paste by forming the via-hole extended to a conductive layer from a second principal surface of a lamination substrate laminated on the substrate where the conductive layer is formed on a first principal surface, bonding the conductive layer and the bump with the conductive paste by adhering the lamination substrate on the substrate via an insulating layer, and dividing the substrate into individual pieces. <P>COPYRIGHT: (C)2008,JPO&INPIT |
