| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To focus an objective optical element by using beam profiling, and to maintain a focus of the objective optical element during the laser beam machining. <P>SOLUTION: An observation substrate 14 having a reference measurement surface 13 with laser beams applied thereto is arranged on a beam observation device 1 provided on a laser beam machining apparatus 3. The focus of the machining laser beams is aligned to the reference measurement surface 13 based on the irradiation shape of laser beams on the reference measurement surface 13 which is image-picked up and displayed by a CCD camera 15. Next, the position of the reference measurement surface 13 along the application direction of the machining laser beams is measured by using the laser beams for measurement. In other words, the position of the reference measurement surface 13 is measured as the light receiving position at a light receiving surface of a PSD measurement device for receiving the reflected laser beams for measurement, and the light receiving position is defined as the reference light receiving position. During the work, the position of the objective optical element is moved corresponding to the deviation of the light receiving position. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
