| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board with which conductors of a plurality of layers can be connected by small-diameter inner via-holes even in a product with large thickness between insulating layers. SOLUTION: A method of manufacturing a multilayer printed wiring board is characterized in including: laminating a plurality of sheets of prepregs having through-holes filled with a conductive paste with a predetermined insulating layer thickness in such a way that positions of through-holes become identical; then coating both sides with metal foils; and holding the laminated prepregs between metal plates, heating and pressing them to perform interlayer connection between metal foils at predetermined positions. COPYRIGHT: (C)2008,JPO&INPIT |
