| 摘要 |
PROBLEM TO BE SOLVED: To improve the dimensional accuracy of patterning in device microfabrication. SOLUTION: The substrate processing method repeats a lithography step wherein the substrate processing system provided with a plurality of processing units of multiple kinds are used to conduct at least resist application treatment, exposure treatment, heating after exposure and lithography treatment such as development or the like to a semiconductor wafer so as to form a specified pattern and an etching step to employ the treated pattern as a mask. In this case, it is judged whether a substrate to be treated is treated first time or second time or more. When it is judged substrate treatment is the first time, the substrate is treated by the specified processing unit in the lithography according to the conveyance schedule of first-time wafers. When it is judged substrate treatment is the second or subsequent, the wafer is subject to the processing of lithography step according to the substrate conveyance schedule using the processing unit that is used in the lithography step in the conveyance history of the previous wafer. COPYRIGHT: (C)2008,JPO&INPIT
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