摘要 |
A particle with a rough surface for plating or vapor deposition which has been formed from a base (A) having first functional groups on the surface thereof and particles (B) having on the surface thereof second functional groups reactive with the first functional groups and having an average particle diameter which is smaller than the diameter of the base (A) and not smaller than 0.1 mum, by uniting the base (A) with the particles (B) through chemical bonds between the first functional groups and the second functional groups, wherein the base (A) has at least two projecting parts on the surface thereof. In this particle, the base has been tenaciously bonded to the protruding particles. Because of this, even when the protruding particles used have a size not smaller than the given size, the particle with a rough surface can secure a surface area while maintaining a thickness of a conductive coating film. As a result, the particle can have high conductivity.
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