发明名称 Sondenanordnung, Verfahren zu ihrer Herstellung und elektrische Verbindungsvorrichtung
摘要 A probe assembly for use in electrical measurement of a device under test. The probe assembly comprises a plate-like probe base plate with bending deformation produced in a free state without load, and a plurality of probes formed on one face of the probe base plate to project from the face. All the tips of the probes are positioned on the same plane parallel to an imaginary reference plane of the probe base plate.
申请公布号 DE112005003580(T5) 申请公布日期 2008.05.29
申请号 DE20051103580T 申请日期 2005.05.23
申请人 KABUSHIKI KAISHA NIHON MICRONICS 发明人 MIURA, KIYOTOSHI;KIYOFUJI, HIDEHIRO;MIYAGI, YUJI;KUNIYOSHI, SHINJI;SATO, HITOSHI
分类号 G01R31/28 主分类号 G01R31/28
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