| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing device for an IC chip mounting body, improving supply capacity of an IC chip supply section. <P>SOLUTION: The manufacturing device includes a carrier section for carrying a film substrate, and an IC chip mounting section for mounting IC chips on the film substrate. The IC chip mounting section includes an IC chip supply section for selecting and successively supplying IC chips directing to a predetermined direction from among a plurality of IC chips, a direction discrimination section for discriminating the direction of each IC chip supplied from the IC chip supply section, a roller for mounting the IC chips on the film substrate, by having an IC chip retention section on a circumference plane, and retaining and rotating the IC chips supplied from the IC chip supply section, and a drive mechanism for controlling the position and the rotation of the roller. The drive mechanism moves the mounting position of each IC chip for a predetermined amount by controlling the roller according to the direction of each IC chip discriminated by the direction discrimination section. <P>COPYRIGHT: (C)2008,JPO&INPIT |
