| 摘要 |
PROBLEM TO BE SOLVED: To provide structure capable of obtaining a semiconductor device of which connection reliability and durability are improved, at high yield. SOLUTION: The semiconductor device is provided with: a mounting board (printing wiring board 12); a circuit board 16 mounted on the mounting board with a separation of a prescribed distance through a solder bump; a first solder bump 20 formed between the lower surface of the circuit board 16 and an upper surface area of the printed wiring board 12, on which a mounting pad 14 is not formed; and a second solder bump 22 for joining an electrode pad 18 formed on the lower surface of the circuit board 16 with the mounting pad 14 formed on the upper surface of the printed wiring board 12, between the circuit board 16 and the printed wiring board 12 separated by a prescribed distance. In a cross-sectional shape of the second solder bump 22 in a direction orthogonal to the upper surface of the printed wiring board 12, the width of a center part is narrower than the width of an end part joined with the printed wiring board 12 or the circuit board 16. COPYRIGHT: (C)2008,JPO&INPIT
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