| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable thermal conductive substrate preventing cracks from occurring in a heat conductive sheet and preventing separation from occurring in a wiring electrode. SOLUTION: The thermal conductive substrate has: the wiring electrode 2 for transmitting a signal transmitted and received between a semiconductor device 1 and the outside or a power supply; a heat conductive sheet 3 in contact with the wiring electrode 2 for conducting heat; and a base plate 4 in contact with the heat conductive sheet 3 for supporting the semiconductor device 1 and the wiring electrode 2. In the thermal conductive substrate, a heat conductive member 5 is formed in a way that it covers a region from the side of the wiring electrode 2 to the heat conductive sheet 3 for surrounding the wiring electrode 2. COPYRIGHT: (C)2008,JPO&INPIT
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