| 摘要 |
A testing jig of electronic signal is disclosed. The testing jig of electronic signal capable of providing electrical connection between a plurality of contact pads of the circuit board and a plurality of ball-shaped leads of the ball-grid-array packaging device in order to perform testing with respect to the ball-grid-array packaging device includes a connecting interface and at least a conducting gel. The connecting interface has a plurality of guiding connecting devices, each of them is one-to-one correspondent to the plurality of contact pads wherein each of the guiding connecting devices is aligned with and electrically connected to the contact pad. The conducting gel has a first side surface and a second side surface. The first side surface being bonded to the connecting interface is connected to the other end of the guiding connecting devices while the second side surface is bonded and connected to the plurality of ball-shaped leads. The conducting gel having a plurality of conducting wires makes the first side surface and the second side surface perform electrical connection.
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