发明名称 |
Hybrid clamshell blade system |
摘要 |
A hybrid clamshell system encapsulates two of the six sides of an electronic circuit board to provide a high heat density solution and environmental protection. The clamshell enclosures seal to both sides of the PCB and contain fluid shut-off couplings. A two-phase cooling system directs a coolant via a supply path located in the sidewall of the enclosure to one or more cooling modules and collects the coolant via a return path within the enclosure. With the addition of an inject/eject mechanism attached to the clamshell, the fully assembled blade can be "fluid hot-swapped" in and out of the chassis with negligible loss of coolant. The interrelation of the clamshell module and it's implementation in an exemplary system are detailed herein.
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申请公布号 |
US2008123297(A1) |
申请公布日期 |
2008.05.29 |
申请号 |
US20070803750 |
申请日期 |
2007.05.15 |
申请人 |
ISOTHERMAL SYSTEMS RESEARCH, INC. |
发明人 |
TILTON DONALD E.;CADER TAHIR;GRABOWSKI ERIC;BADDELEY RYAN J.;PARK P. HARLEY;MOHR PETER;TOLMAN BENJAMIN H.;ALDER NORMAN O. |
分类号 |
H05K7/20;F25D23/12 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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