发明名称 Hybrid clamshell blade system
摘要 A hybrid clamshell system encapsulates two of the six sides of an electronic circuit board to provide a high heat density solution and environmental protection. The clamshell enclosures seal to both sides of the PCB and contain fluid shut-off couplings. A two-phase cooling system directs a coolant via a supply path located in the sidewall of the enclosure to one or more cooling modules and collects the coolant via a return path within the enclosure. With the addition of an inject/eject mechanism attached to the clamshell, the fully assembled blade can be "fluid hot-swapped" in and out of the chassis with negligible loss of coolant. The interrelation of the clamshell module and it's implementation in an exemplary system are detailed herein.
申请公布号 US2008123297(A1) 申请公布日期 2008.05.29
申请号 US20070803750 申请日期 2007.05.15
申请人 ISOTHERMAL SYSTEMS RESEARCH, INC. 发明人 TILTON DONALD E.;CADER TAHIR;GRABOWSKI ERIC;BADDELEY RYAN J.;PARK P. HARLEY;MOHR PETER;TOLMAN BENJAMIN H.;ALDER NORMAN O.
分类号 H05K7/20;F25D23/12 主分类号 H05K7/20
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