| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal conductive route plate, an electronic part substrate and an electronic part housing capable of efficiently diffusing, transporting, and concentrating heat to perform heat dissipation in an arbitrary conductive heat transport route by utilizing a high temperature conductive material having plane anisotropic thermal conductivity. SOLUTION: The electronic part substrate can be configured by affixing a thermal conductive route sheet 108 to a printed circuit board where an electronic part 109 is disposed and an electric wiring is laid and the like. The thermal conductive route sheet can be attached to the electronic part substrate by other existing substrate preparation technologies in addition to sticking ones. However, in case that the sheet 108 is conductive, insulation treatment should be performed between the sheet 108 and the wiring board. For the sheet 108, the thermal conductive route with high heat transport rate is provided by combining the direction and shape of high heat transport rate of isotropic high temperature conductive material and shape of high and low thermal conductive materials with thermal conductive isotropy in accordance with electronic part layouts. COPYRIGHT: (C)2008,JPO&INPIT
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