| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing method for easily recovering a removal rate in removing a resist or the like using a catalyst electrode consecutively. SOLUTION: In the substrate processing method, after a predetermined number of processings are performed, power is turned on without the substrate W being put into the chamber 10, and a flushing processing is performed. A right side chamber 10 in Fig.1 shows the chamber in such a situation. The flushing processing removes reaction products or the like adhered to the surface of the catalyst electrode 17 and cleans the surface of the catalyst electrode 17. COPYRIGHT: (C)2008,JPO&INPIT
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