| 摘要 |
PROBLEM TO BE SOLVED: To correct warp generated when a semiconductor chip is subjected to flip chip mounting on an organic wiring substrate. SOLUTION: A semiconductor device is manufactured, which has an organic wiring substrate with a first major surface and a second major surface, a supporting plate with a first major surface and a second major surface and a semiconductor chip. The first major surface of the organic wiring substrate and the second major surface of the supporting plate are adhered, the organic wiring substrate has a first external connection terminal and a second external connection terminal in the second major surface, the semiconductor chip is connected to the first external connection terminal, the semiconductor chip and the organic wiring substrate are adhered by means of an underfill resin layer and the first major surface of the supporting plate has a rib skeleton structure. COPYRIGHT: (C)2008,JPO&INPIT
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