发明名称 SURFACE TREATMENT METHOD AND APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a surface treatment method capable of easily extracting or separating prescribed components in a treatment fluid and supplying components required for treatment to an object to be treated. <P>SOLUTION: The treatment fluid containing a starting material CF<SB>4</SB>from a treatment fluid source 1 is introduced into a plasma making means 20 and made into plasma and a primary reactant gas containing COF<SB>2</SB>, HF and CF<SB>4</SB>, etc., is obtained. The primary reactant gas is condensed in a condensation generation means 30 to obtain reaction liquid comprising an HF aqueous solution. The reaction liquid is vaporized to obtain a secondary reactant gas containing HF, and the secondary reactant gas is brought into contact with the object W to be treated. The CF<SB>4</SB>of the starting material is not condensed in the condensation generation means 30 and is returned to the plasma making means 20 in a non-condensed gas path 15. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008124356(A) 申请公布日期 2008.05.29
申请号 JP20060308715 申请日期 2006.11.15
申请人 SEKISUI CHEM CO LTD 发明人 ISHII TETSUYA
分类号 H01L21/3065;B08B7/00;H01L21/304;H05H1/24 主分类号 H01L21/3065
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