发明名称 FILM THICKNESS MEASURING METHOD
摘要 PROBLEM TO BE SOLVED: To precisely measure the thickness of a thin film on the surface of an object of film formation. SOLUTION: Thin films are made to grow on the surfaces of a calibrating crystal oscillator 1 and a measuring crystal oscillator 2, and their film thicknesses are measured beforehand. In a film forming process, the thickness of a film on the surface of the object 15 of film formation is acquired by multiplying a measurement value P of the measuring oscillator 2 by C/M being the ratio of measurement values in a calibration process. It does not matter if a sound impedance ratio Z of the measuring crystal oscillator acquired from the resonance frequencies of the calibrating oscillator 1 and the measuring oscillator 2, to acquire the precise film thickness. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008122200(A) 申请公布日期 2008.05.29
申请号 JP20060305600 申请日期 2006.11.10
申请人 ULVAC JAPAN LTD 发明人 FUKAO MARI;KIKUCHI HIROSHI
分类号 G01B17/02;G01N5/02 主分类号 G01B17/02
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