| 摘要 |
A boat structure of semiconductor fabricating equipment is provided to minimize the area with which a wafer comes in contact even if warpage occurs in the wafer, by forming a protrusion part on the plane of a slot of a boat. Upper and lower members(37,38) are made of a circular type. A plurality of rods(33,35) are vertically installed between the upper and lower members. A plurality of slots(39) are formed at regular intervals in the plurality of rods. Protrusion parts are respectively formed on the bottom surfaces of the plurality of slots. The protrusion part can reduce generation of particles caused by warpage of a wafer when the wafer is mounted.
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