Cooling unit for semi-conductor components or similar heat sources and method for its manufacture

摘要

The cooling element (91) has a closure profile (88), which is attached to plate shaped base plate. The profile consists of chamfers (96) at a base or lower surface for receiving profile strips of the base plate. A spheroidization is formed between the chamfers of the closure profile, and is overstretched in a connecting position with the base plate. The spheroidization, which is limited by the base plate, forms a channel shaped hollow chamber. An independent claim is also included for a method for producing the cooling element.