发明名称 |
FCBGA PACKAGE STRUCTURE |
摘要 |
FCBGA Package Structure The present invention discloses a structure of package. The structure comprises a flip chip solder bumping structure having a plurality of solder bumps. A substrate has a plurality of conductive lines electrically coupling with the plurality of solder bumps. A print circuit board has a plurality of solder balls electrically coupling with the plurality of conductive lines. |
申请公布号 |
SG142144(A1) |
申请公布日期 |
2008.05.28 |
申请号 |
SG20040077079 |
申请日期 |
2004.12.15 |
申请人 |
ADVANCED CHIP ENGINEERING TECHNOLOGY INC. |
发明人 |
YANG WEN KUN |
分类号 |
(IPC1-7):H01L23/28;H01L23/31;H01L23/48;H01L23/485;H01L23/50;H01L23/52 |
主分类号 |
(IPC1-7):H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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