| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which the element forming a surface of a semiconductor chip is stably fixed to a circuit board, in the state where the element forming surface of the semiconductor chip is supported in substantially parallel with the circuit board, when the semiconductor chip having an electrode pad called a center pad is flip-chip mounted at a central part on the circuit board, and the connecting fault of the semiconductor chip to the circuit board or the decreases of connecting reliability is prevented, and also to provide a method for manufacturing the same. <P>SOLUTION: When the semiconductor chip 1 having an electrode terminal 5 provided at the central part of the element forming surface is flip-chip mounted in the installing state at the connecting electrode 3 of the circuit board 2, a solder resist opening 12 larger than the element forming surface of the semiconductor chip 1 is provided in an insulator layer 6 on the front surface of the circuit board 2. The connecting electrode 3 having a protruding shape, and a support 4 having substantially the same height as the connecting electrode 3 for supporting the semiconductor chip 1 and the circuit board 2 in substantially parallel with each other, are provided in the solder resist opening 12. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
