EPOXY RESIN COMPOSITION FOR ENCAPSULATING MULTICHIP PACKAGE AND THE MULTICHIP??PACKAGE USING THE SAME

摘要

An epoxy resin composition for sealing a multichip package, and a multichip package prepared by using the composition are provided to improve moisture resistance, crack resistance and tensile characteristics and to inhibit the generation of void, thereby enhancing molding property and confidence. An epoxy resin composition comprises an epoxy resin; a curing agent; a curing accelerator; a coupling agent containing a hydroxysiloxane resin having a hydrocarbon group; and an inorganic filler. Preferably the hydroxysiloxane resin containing a hydrocarbon group is a dimethylhydroxysiloxane resin. More preferably the hydroxysiloxane resin is represented by the formula 1, wherein n is 1-20; and R1 to R16 are a C1-C6 alkyl group or a phenyl group.