发明名称 |
Heat-resistant adhesive tape for manufacturing semiconductor device |
摘要 |
The present invention provides a heat-resistant adhesive tape for manufacturing a semiconductor device usable in a method for manufacturing a semiconductor device including at least the steps of mounting a semiconductor chip on a die pad of a metallic lead frame in which a heat-resistant adhesive tape is adhered to an outer pad side to bond the semiconductor chip thereto, subjecting a semiconductor chip side to a single-sided encapsulation with an encapsulating resin, and dicing the encapsulated constructed product to individual semiconductor devices, characterized in that the heat-resistant adhesive tape comprises a substrate layer, and an adhesive layer containing a hydrophilic layered silicate and an adhesive. |
申请公布号 |
EP1926137(A2) |
申请公布日期 |
2008.05.28 |
申请号 |
EP20070022117 |
申请日期 |
2007.11.14 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
AMANO, YASUHIRO;KONDO, HIROYUKI;OKEYUI, TAKUJI;TERADA, YOSHIO |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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