| 摘要 |
<p>An electromagnetic wave shielding apparatus, a high-frequency module with the same, and a manufacturing method thereof are provided to protect chips and prevent a harmful electromagnetic wave from being radiated to the outside. An electromagnetic wave shielding apparatus includes a mold member(123), a ground part, and a plated film(125). The electromagnetic shielding apparatus is installed in a high-frequency module(100). In the high-frequency module, chip components(113) are mounted on a module substrate(110). The mold member protects the chip components. The ground part is formed on the module substrate. The plate film is formed in an upper part of the mold member and in one upper part of the module substrate, and is electrically connected to the ground part.</p> |
