发明名称 ATMOSPHERIC PRESSURE PLASMA ETCHING EQUIPMENT
摘要 An air pressure plasma etching apparatus is provided to keep uniformly a gap between a stage and a plasma module by reciprocating the stage to the all directions about the plasma module. A stage transfer unit(20) which is able to reciprocate to the forward and backward directions is installed inside a process chamber(1). A stage(10) which is able to reciprocate to the left and right directions from the stage transfer unit is provided, and processed substrates are placed on the stage. A plasma generating unit(30) is installed above the process chamber. A driving motor(28) is installed at the any one out of stage or the stage transfer unit, and a lack gear(12) is installed at the other one so as to be interconnected with a rotation axis of the driving motor. A guide member(40) is installed between the stage and the stage transfer unit.
申请公布号 KR100832473(B1) 申请公布日期 2008.05.27
申请号 KR20060108956 申请日期 2006.11.06
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, SANG HO;YIM, SOON KYU;KIM, SANG GAB;LIM, KYUNG CHUN
分类号 H01L21/3065 主分类号 H01L21/3065
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