Positive type photosensitive epoxy resin composition and printed circuit board using the same

摘要

A printed circuit board comprising an insulating layer prepared with the aid of a positive type photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule; (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent, and (d) a photosensitive acid generator.