发明名称 ADHESIVE FILM CUTTING MACHINE, ADHESIVE FILM STICKING EQUIPMENT HAVING THE CUTTING MACHINE AND ADHESIVE FILM CUTTING & STICKING METHOD BY USING THE CUTTING MACHINE
摘要 An adhesive film cutting apparatus, adhesive film stick equipment having the same, and an adhesive film cutting and sticking method are provided to minimize collision occurring while cutting an adhesive film by cutting only the adhesive film among roll films. An adhesive film cutting apparatus includes a roll film absorption unit(310) and an adhesive film cutting unit(320). The roll film absorption unit absorbs a roll film composed of a dual layer having an adhesive film(20) and a release film(10). The adhesive film cutting unit cuts the adhesive film from one side thereof to another side. The adhesive film cutting unit includes a film cutting portion(321), a cutting rod support portion(322), and a horizontal transfer portion(323). The film cutting portion has a cutting rod and a film cutter engaging with one end of the cutting rod. The cutting rod support portion engages with the cutting rod and supports the cutting rod. The horizontal transfer portion engages with the cutting rod support portion and transfers the film cutting portion to the adhesive film to cut the adhesive film by the film cutter.
申请公布号 KR20080046332(A) 申请公布日期 2008.05.27
申请号 KR20060115648 申请日期 2006.11.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YOO, SANG WOOK;SON, JIN SEOK
分类号 G02F1/13;B65H35/00 主分类号 G02F1/13
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