发明名称 CLAMP LINK APPARATUS IN CARRIER ASSEMBLY
摘要 A clamp link apparatus in a carrier assembly is provided to improve shock-resistance with reinforced durability and ensure stability after long-term use by installing a spring within a body. A clamp link apparatus(100) in a carrier assembly comprises a cylinder-shaped link portion(110), and a body(120) configured to support the link portion, having a spring(130) on its inside connected to the link portion to facilitate contraction and expansion of the link portion. The clamp link apparatus is assembled to a plate. The link portion is configured to apply a current to the plate for holding a wafer.
申请公布号 KR20080046342(A) 申请公布日期 2008.05.27
申请号 KR20060115678 申请日期 2006.11.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SEUL, MAN SU
分类号 H01L21/02 主分类号 H01L21/02
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