FABRICATING METHOD OF PRINTED CIRCUIT BOARD

摘要

A method of fabricating a printed circuit board is provided to prevent a via-open or a void by improving contact intensity between a circuit pattern and an insulating layer. A method of fabricating a printed circuit board includes the steps of: forming a via hole on a copper clad laminate obtained by cladding copper on both surfaces of an insulating layer(102); forming a seed layer by closely adhering conductive carbon material to an inner wall of the via hole; exposing a copper foil of a portion to be a circuit pattern(116) through exposure and development processes by coating a dry film on the copper foil; forming an electrolytic copper plating layer on the exposed copper foil; and forming the circuit pattern by removing the copper foil of a portion where the dry film is removed after removing the dry film.