发明名称 |
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device |
摘要 |
An adhesive film for semiconductor, which comprises at least one resin layer, and, after bonded to a lead frame, has at 25° C. a 90°-peel strength of at least 5 N/m between the resin layer and the lead frame, and, after a lead frame is bonded to the adhesive film for semiconductor and sealed with a sealing material, has at least at one point of temperatures ranging from 0 to 250° C. a 90°-peel strength of at most 1000 N/m between the resin layer and each of the lead frame and the sealing material; a lead frame and a semiconductor device using the adhesive film for semiconductor; and a method of producing a semiconductor device.
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申请公布号 |
US7378722(B2) |
申请公布日期 |
2008.05.27 |
申请号 |
US20060347204 |
申请日期 |
2006.02.06 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
KAWAI TOSHIYASU;MATSUURA HIDEKAZU |
分类号 |
H01L21/60;H01L23/495;C09J7/00;C09J7/02;H01L21/52;H01L21/56;H01L21/68;H01L23/31;H01L23/48 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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