CARBON FIBER STIFFENER FOR PRINTED CIRCUIT BOARD

摘要

A carbon fiber stiffener for a printed circuit board is provided to implement thin film packaging with high reliability by approximating a coefficient of thermal expansion to zero and improving mechanical stiffness and thermal conductivity. A carbon fiber stiffener for a printed circuit board is formed by impregnating any one of woven type carbon fiber clothes(10a,10b) or composite type carbon fibers or a combination thereof on a base. The base is any one of resin or metal. A copper foil is further coated on a surface of the carbon fiber stiffener for the printed circuit board. The carbon fiber stiffener for the printed circuit board is formed on top and bottom surfaces of the metal with high thermal conductivity and constitutes a carbon fiber-metal-carbon fiber layer.