| 摘要 |
<p>An electromagnetic wave shielding apparatus, a high frequency module having the same, and a method for manufacturing the same are provided to reduce a manufacturing cost of products by reducing the number of assembling components and simplifying a manufacturing process of the high frequency module. An electromagnetic wave shielding apparatus includes a mold member(123), a conducting hole(124), and a conducting film(125). The mold member has the conducting hole, and is formed on an upper part of a chip component(113). The conducting film is formed on a surface of the mold member using a print scheme. A printed part of the conducting film is electrically coupled to a ground unit of a module substrate(110) through the conducting hole of the mold member. The conducting hole is formed on a position corresponding to the ground unit of the module substrate. At least one conducting hole and at least one ground unit are formed. The ground unit is selectively formed between chip components of the module substrate and on a region except a component-mounted region.</p> |
