IMAGE SENSOR MODULE EQUIPPED WITH IMAGE SENSOR AND CAMERA MODULE PACKAGE USING IT

摘要

A sensor embedded type image sensor module and a camera module package by using the same are provided to reduce the number of assembly processes of a product, thereby reducing the manufacturing cost of the product. Two or more layered sheets are stacked on a substrate(210) with a multi-layer structure. A square type of a receiving groove(220) is equipped to the center of the substrate. An image sensor(230) is mounted to the inside of the receiving groove of the substrate and connected electrically to the inner circuit pattern by a wire bonding. Step portions(222,224) are formed on the inner and outer surfaces of the substrate and have vertical portions protruded upwardly along the upper edge. The substrate is made of a ceramic substrate by means of plural ceramic sheets. The height of the sidewall of the receiving groove is higher than that of the wire bonding for connecting the image sensor with the substrate electrically.