WAFER LEVEL PACKAGE WITH DIE RECEIVING CAVITY AND METHOD OF THE SAME

摘要

A wafer level package with die receiving cavity and its method are provided to offer a FO-WLP(fan out-wafer level package) structure not having an RDL(re-distribution layer) for reducing a thickness of the package, and offer an excellent board level reliability test of temperature circulation. A substrate comprises a die receiving cavity formed within an upper surface of the substrate, and a through hole structure(6). A die is disposed within the die receiving cavity(4) by adhesion. A dielectric layer(18) is formed on the die and the substrate. An RDL(24) is formed on the dielectric layer, wherein the RDL is coupled to the die and a terminal pad through the through hole structure. Wherein a terminal pad is formed under the through hole structure and a conductive trace formed on a lower surface of the substrate.