发明名称 |
MAGNETRON SPUTTERING APPARATUS |
摘要 |
A magnetron sputtering apparatus enabling improvement of the film-forming speed by increasing the erosion density on the target at every movement and prolongation of the target life by realizing uniform consumption of the target by moving the erosion region with time. Plate magnets (3) are arranged around a columnar rotary shaft (2). A high-density erosion region is formed on a target (1) by rotating the columnar rotary shaft (2) so as to increase the film-forming speed. Since the erosion region is moved with rotation of the columnar rotary shaft (2), the target (1) is consumed uniformly.
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申请公布号 |
KR20080046285(A) |
申请公布日期 |
2008.05.26 |
申请号 |
KR20087009253 |
申请日期 |
2008.04.17 |
申请人 |
TOHOKU UNIVERSITY;TOKYO ELECTRON LIMITED |
发明人 |
OHMI TADAHIRO;GOTO TETSUYA;MATSUOKA TAKAAKI |
分类号 |
C23C14/35 |
主分类号 |
C23C14/35 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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