| 摘要 |
Disclosed is a multilayer printed wiring board wherein a resin insulating layer and a conductor circuit are sequentially formed on another resin insulating layer containing a semiconductor device and the semiconductor device and the conductor circuit are electrically connected through a via hole. In the multilayer printed wiring board, the semiconductor device is placed in a recessed portion formed in the resin insulating layer, and a metal layer for mounting the semiconductor device is formed on the bottom surface of the recessed portion. Also disclosed is a semiconductor device-mounted substrate. In this multilayer printed wiring board, the built-in semiconductor device has an electrical connection through a via hole. |
