| 摘要 |
PROBLEM TO BE SOLVED: To provide a defect inspection device capable of detecting with high sensitivity the defects in a mixed mount wafer (system LSI, or the like), capable of detecting widely a defect species, and capable of enhancing a defect capturing rate, and to provide a method therefor. SOLUTION: A detection optical path is branched into two, in response to the periodicity of a pattern formed on a surface of an inspection object, and spatial filters with different opening shapes are arranged in the respective optical paths. A dimming filter is provided in the optical path with relatively high luminous energy, after the spatial filter to restrain the saturation of an image sensor. Polarization elements are provided, respectively in the first and second detection optical paths branched in a dark field optical system, and are set to bring lights transmitted, through the polarizing elements arranged in the first and second detection optical paths into different characteristics, and the defect-capturing rate is enhanced thereby. COPYRIGHT: (C)2008,JPO&INPIT |
