RESIN SEALING MOLD FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a resin sealing mold for an electronic component which makes various resin materials (including a strong adhesion sealing material) satisfy both mold release properties and corrosion resistance of the mold and form the surface treatment layer of the mold enough in consideration of environmental problems. SOLUTION: By forming a chromium carbide film A (surface treatment layer) in a necessary place of each of the surfaces of these molds 1 and 2 by depositing (surface treatment) by a vacuum film depositing method, the resin sealing molding of the electronic component 5 set on a substrate 6 can be carried out in mold cavities 3 and 4. COPYRIGHT: (C)2008,JPO&INPIT